测试系统配置介绍(Tester System Configuration)
Company |
PartNo |
Q'ty |
Device
type |
Digital
Channel |
Analog
Channel |
Pattem
Deep |
Tester
frequency |
Voltage
Scale |
Current
Scale |
VI
Source |
Current
Source |
VTT |
777 |
15 |
Dig+Mem |
128 |
0 |
16k*1M |
10MHz |
+/-35V |
+/-500mA |
8 |
8 |
| TRI |
TR-6010 |
20 |
Digital |
128 |
0 |
16k*2M |
10MHz |
+/-18V |
+/-1A |
8 |
8 |
TR-6800 |
2 |
Mix |
32 |
16 |
16k*2M |
20MHz |
+/-32V |
+/-2A |
16 |
16 |
TR-6050 |
2 |
Digital |
256 |
0 |
4M |
66MHz |
+/-20V |
+/-1A |
8 |
8 |
SYSTEST |
Q2-52 |
10 |
Memory |
40 |
0 |
4M |
10MHz |
+/-20V |
+/-500mA |
8 |
8 |
YTEC |
SCUD256 |
10 |
Mix |
256 |
32 |
1M |
25MHz |
+/-45/15 |
+/-2A |
16 |
16 |
SCUD-1A |
5 |
Digital |
256 |
0 |
4M |
50MHz |
+/-45/15 |
+/-2A |
8 |
8 |
|
|
|
|
|
|
|
|
|
|
|
|
探针台系统配置介绍(Prober System Configuration)
Company
|
Part
No. |
Q'TY |
Offline
linking |
Heading |
Contact
type |
Testing
wafer size |
3
inch |
4
inch |
5
inch |
6
inch |
8
inch |
EG |
EG2001 |
15 |
Availble |
Available |
Cable+Mau palter |
A |
A |
A |
A |
A |
TSK |
UF200A |
15 |
Available |
Available |
Cable+Mau palter |
|
A |
A |
A |
A |
切割设备、挑粒设备、减薄设备系统介绍(Cutting、 Sorting、
Grinding Machine Syetem Configuration)
Item
|
Company
|
Q'ty
|
Wafer
Size Ability |
3
inch |
4 inch |
5 inch |
6 inch |
8 inch |
Dicing |
DISCO |
2 |
A |
A |
A |
A |
A |
Cleaning |
DISCO |
1 |
A |
A |
A |
A |
A |
Sorting |
KINGBOND |
2 |
A |
A |
A |
A |
A |
Gringing |
DISCO |
1 |
A |
A |
A |
A |
A |
Taping |
NITTO |
1 |
A |
A |
A |
A |
A |
De-taping |
NITTO |
1 |
A |
A |
A |
A |
A |
UV mapping |
ARON DENKI |
1 |
A |
A |
A |
A |
A |
Microscope |
GZ |
15 |
- |
- |
- |
- |
- |
Vacuum pack |
GZ |
2 |
- |
- |
- |
- |
- |
Oven |
ESPEC |
3 |
- |
- |
- |
- |
- |
ESD Detector |
SIMCO |
2 |
- |
- |
- |
- |
- |
ESD Fan |
SHIN HAN |
1 |
- |
- |
- |
- |
- |
机械手、编带机、处观检查机系统配置介绍(Handler、taping、Machine
Lead Scan Machine Configuration)
Item |
Company |
Part
No. |
Q'ty |
Contact
Type |
Final
Product Outline |
DIP |
SOP |
HSOP |
QFP |
PLCC |
TSSOP |
SSOP |
SIP |
Handler |
MULTITEST |
TSSOP |
3 |
Normal+kevin |
- |
- |
- |
- |
- |
A |
- |
- |
SSOP |
4 |
Normal+kevin |
- |
- |
- |
- |
- |
- |
A |
- |
SEIMJESS |
DIP |
15 |
Normal |
A |
- |
- |
- |
- |
- |
- |
- |
SOP/HSOP |
15 |
Normal |
- |
A |
A |
- |
- |
- |
- |
- |
TRIPOD |
TO/SIP |
3 |
Normal |
- |
- |
- |
- |
- |
- |
- |
A |
SEIKO EPSON |
QFP/BGA |
2 |
Normal |
- |
- |
- |
- |
A |
A |
A |
- |
CHIPRIGHT |
QFP/BGA |
2 |
Normal |
- |
- |
- |
- |
A |
A |
A |
- |
Lead Scan |
ROOD |
LS800 |
1 |
- |
- |
- |
- |
- |
A |
A |
A |
- |
Taping |
ISMECA |
NT16 |
1 |
- |
- |
- |
A |
A |
A |
A |
A |
- |
封装外形能力介绍(Package and Testing Ability)
类型(Type) |
Body Width |
8 PIN |
14 PIN |
16PIN |
18PIN |
20PIN |
22PIN |
24PIN |
28PIN |
30PIN |
32PIN |
44PIN |
48PIN |
54PIN |
64PIN |
128PIN |
DIP |
300MIL |
A |
A |
A |
A |
A |
A |
A |
A |
A |
A |
- |
- |
- |
- |
- |
DIP |
600MIL |
- |
- |
- |
- |
- |
- |
A |
A |
A |
A |
- |
- |
- |
- |
- |
SDIP |
300MIL |
- |
- |
- |
- |
A |
A |
A |
A |
- |
- |
- |
- |
- |
- |
- |
SOP |
150MIL |
A |
A |
A |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
SOP |
300MIL |
- |
- |
- |
A |
A |
A |
A |
A |
- |
- |
- |
- |
- |
- |
- |
HSOP |
300MIL |
- |
- |
- |
- |
- |
- |
- |
A |
- |
- |
- |
- |
- |
- |
- |
SSOP |
236MIL |
- |
- |
- |
- |
A |
- |
A |
A |
- |
- |
- |
- |
- |
- |
- |
209MIL |
- |
- |
- |
- |
A |
- |
A |
A |
- |
- |
- |
- |
- |
- |
- |
TSSOP |
173MIL |
- |
- |
- |
- |
A |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
QFP |
7*7MM |
- |
- |
- |
- |
- |
- |
- |
- |
- |
A |
A |
- |
- |
A |
A |
| 10*10MM |
- |
- |
- |
- |
- |
- |
- |
- |
- |
A |
A |
- |
- |
A |
A |
14*14MM |
- |
- |
- |
- |
- |
- |
- |
- |
- |
A |
A |
A |
A |
A |
- |
| 分立器件Disceret |
类型Type |
3 PIN |
4 PIN |
23 |
25 |
26 |
89 |
92 |
220 |
220FP |
252FP |
143 |
343 |
263 |
223 |
SIP |
A |
A |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
TO |
- |
- |
- |
- |
- |
- |
A |
A |
A |
A |
- |
- |
- |
- |
SOT |
- |
- |
A |
A |
A |
A |
- |
- |
- |
- |
- |
- |
- |
- |
|